Apple to Revolutionize iPhone 18 with Separate Chip and Memory Design for AI Enhancement

In a bold move to prioritize artificial intelligence, Apple is set to abandon the package-on-package (PoP) memory configuration in its future iPhone 18, opting instead for a design that separates the SoC (System on Chip) from the DRAM chips. Traditionally, Apple's hardware, including its chips and memory, have been integrated together, stacking the memory chips atop the main chip. This approach, known for minimizing physical space usage, is particularly beneficial for mobile devices.

However, starting from 2026, Apple plans to separate the SoC and DRAM chips. The primary motivation behind this shift is to enhance memory bandwidth, which in turn, is aimed at boosting the overall performance of Apple's AI-related services.

The current practice of directly stacking low-power double data rate (LPDDR) memory on the chip, while advantageous for non-AI services in terms of latency reduction and power efficiency, as seen in the Mac and iPad models starting with the M1 chip, faces limitations. The PoP technology restricts memory packaging size to the SoC dimensions, limiting the number of I/O pins and, consequently, performance.

By adopting a separate package design, memory can be physically detached from the SoC, allowing for more I/O pins. This increases data transfer rates and the number of parallel data channels, enhancing performance and potentially offering better heat dissipation.

This design change, however, is not without its challenges. For the iPhone, it necessitates a redesign of the internal circuitry and component placement, possibly requiring a reduction in SoC size or battery dimensions to create space. Although physical separation could theoretically increase latency and power consumption, the addition of more I/O pins is expected to offset these drawbacks by improving data transfer rates.

Samsung is reportedly developing the next-generation LPDDR6 memory technology for Apple, expected to offer data transfer speeds and bandwidth 2 to 3 times that of the current LPDDR5X, significantly enhancing support for local AI computations.

In essence, Apple's significant alterations to the iPhone's internal design for the sake of AI underscore its commitment to making AI a key feature of future iPhones, aiming to attract consumers with the promise of cutting-edge technology.