Samsung Begins Mass Production of the World's Thinnest LPDDR5X Memory Chips, Allowing More Space for Heat Dissipation

According to a press release from Samsung Electronics, the company has started mass production of the world's thinnest 12GB and 16GB LPDDR5X DRAM packages, with a thickness of approximately 0.65 millimeters. This reduces the thickness by 0.06 millimeters compared to the conventional LPDDR5X packages.

Although the reduction in thickness is minimal, it could have a positive impact on the manufacturing of electronic devices such as smartphones. The decrease in thickness allows for a reduction in the device's overall thickness or, if the device's thickness remains unchanged, the thinner memory chip package can free up more space for heat dissipation.

For OEMs, reducing device thickness might not be the primary concern, but having more space for better thermal management could be significant. Improved heat dissipation can also help enhance the read/write performance of memory chips.

Samsung Electronics has adopted new packaging technologies for these DRAMs, including optimized PCB printing and the use of Epoxy Molding Compounds (EMC), then constructing a new package with a 4-layer stacked structure. Additionally, Samsung Electronics has optimized the back grinding process to further reduce thickness.

The typical thickness of current LPDDR5X DRAM packages is about 0.71 millimeters. Samsung’s reduction to 0.65 millimeters has indeed been heat tested, with Samsung claiming that the thermal resistance of the memory chips has improved by 21.2% compared to the previous generation LPDDR5X.

The Executive Vice President of Memory Product Planning at Samsung Electronics stated that this new packaging technology not only provides exceptional LPDDR performance but also offers advanced thermal management in a super-compact package. Samsung Electronics will continue to work closely with customers to innovate and provide solutions that meet the future needs of the low-power DRAM market.

Furthermore, Samsung Electronics is currently planning to expand its LPDDR5X product line to offer more types of memory chips, including developing 6-layer 24GB modules and 8-layer 36GB modules with compact packaging. The 0.65 millimeters thick LPDDR5X DRAM uses a 4-layer stack, and while 6-layer and 8-layer will likely increase the thickness, Samsung, having mentioned this in the press release, seems very confident in managing the thickness.